dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

• 骰子;色子
  Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
• 掷骰子游戏
  Diceis a game which is played using dice.
• VERB 把(食物)切成小块;将…切丁
  If youdicefood, you cut it into small cubes.
  1. Dice the onion...
     把洋葱切成丁。
  2. Add the crushed garlic and remaining diced vegetables.
     加入捣碎的大蒜和剩余的蔬菜丁。

双语例句

• The Technology Study on UV Laser Dicing High Brightness LED Wafer
  高亮度LED晶圆紫外激光划片技术研究
• Alphablox provides drill-down and slicing and dicing capabilities that can answer the types of business questions that we asked earlier.
  Alphablox提供向下钻取和细分功能，以回答我们先前提出的业务问题。
• Dicing area can be washed by water directly and easily be cleaned up.
  切菜区域可直接用水冲刷，清洗方便。
• Just like tags for requirements, categories of your test cases can be invaluable for slicing and dicing your testing data so that you can determine what's really happening.
  就像对于需求的标签一样，测试用例的范畴对于切割测试数据以便决定到底发生了什么来说是无价的。
• Freddy Krueger plays the vengeful monster who kills by slicing, dicing and chopping people who had murdered him.
  弗雷迪·克鲁格扮演一个复仇的魔鬼，他把那些杀害他的人一一肢解至死。
• Experimental Research on Improving Properties of Composite Electroplated Diamond Dicing Blade
  提高复合电沉积金刚石切割片性能的试验研究
• A multiple beam, sub surface laser dicing technology is currently being developed, which will improve the productivity of such a process significantly.
  多光束内部激光划片技术正在开发中，它将显著提高产量。
• After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
  通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
• Design and Implementation of Primary and Secondary Schools Admission Dicing System Based on Proximity Principle
  基于就近原则的中小学招生划片系统设计与实现
• In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
  本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。